A research team co-led by Professor Yang Lu from the Department of Mechanical Engineering, Faculty of Engineering, The University of Hong Kong (HKU), and Professor Chengming Li from the Institute for ...
In the race to develop the next generation of high-performance semiconductor devices, thermal management has emerged as a critical bottleneck. From AI accelerators in hyperscale data centers to RF ...
Some results have been hidden because they may be inaccessible to you
Show inaccessible results